Problem: Silicon for computer chips is grown in large cylinders called “boules” that are 300 mm in diameter and 2 m in length, as shown. The density of silicon is 2.33 g/cm3. Silicon wafers for making integrated circuits are sliced from a 2.0 m boule and are typically 0.75 mm thick and 300 mm in diameter.How many wafers can be cut from a single boule?

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1 mm = 10-3 m


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Problem Details
Silicon for computer chips is grown in large cylinders called “boules” that are 300 mm in diameter and 2 m in length, as shown.A diamond blade slices wafers off a silicon boule cylinder that is 2 meters long. The cut wafers are 0.75 millimeters thick and 300 millimeters in diameter.  The density of silicon is 2.33 g/cm3. Silicon wafers for making integrated circuits are sliced from a 2.0 m boule and are typically 0.75 mm thick and 300 mm in diameter.


How many wafers can be cut from a single boule?

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